| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption while processing data packets in diag received from Unix clients. |
| Memory corruption in Audio when memory map command is executed consecutively in ADSP. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Transient DOS in Data modem while handling TLB control messages from the Network. |
| Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. |
| Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. |
| Information disclosure in Audio while accessing AVCS services from ADSP payload. |
| Information disclosure in WLAN HAL while handling command through WMI interfaces. |
| Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation. |
| Memory corruption when resource manager sends the host kernel a reply message with multiple fragments. |
| Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |