| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. |
| Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. |
| Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Memory corruption when BTFM client sends new messages over Slimbus to ADSP. |
| Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. |
| Memory corruption while parsing qcp clip with invalid chunk data size. |
| Weak Configuration due to improper input validation in Modem while processing LTE security mode command message received from network. |
| Memory Corruption in Data Modem while making a MO call or MT VOLTE call. |
| Memory corruption while invoking IOCTLs calls in Automotive Multimedia. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Transient DOS while parsing probe response and assoc response frame. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |